2 edition of 1970 International Hybrid Microelectronics Symposium. found in the catalog.
1970 International Hybrid Microelectronics Symposium.
International Hybrid Microelectronics Symposium Beverly Hills, Calif. 1970.
Includes bibliographical references.
|Statement||[Edited by Samuel L. Marshall & David Haggerty.|
|Contributions||Marshall, Samuel L. 1908- ed., Haggerty, David, ed., International Society for Hybrid Microelectronics.|
|LC Classifications||TK7874 .I58 1970|
|The Physical Object|
|Pagination||1 v. (various pagings)|
|LC Control Number||74029131|
In , the "Kenneth C. Smith Early Career Award for Microelectronics Research" was created by the International Symposium on Multiple-Valued Logic to honor Smith for his contribution to the field of multiple-valued for: Microelectronics. Geoffrey William Arnold Dummer, MBE (), C. Eng., IEE Premium Award, FIEEE, MIEE, USA Medal of Freedom with Bronze Palm (25 February – 9 September ) was an English electronics engineer and consultant who is credited as being the first person to popularise the concepts that ultimately lead to the development of the integrated circuit, commonly called the microchip, in the late Alma mater: Manchester College of Technology.
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Structure and Electrical Properties of Titanium Nitride Films. T. Muto and Y. Igasaki Proc. Int. Symp. Hybrid Microelectronics Conf., Los Angeles, (International Society for Hybrid Microelectronics, Park Ridge, Illinois). Google Scholar Cited by: Christophe Copéret, ETH Zurich, Switzerland. Prof. Christophe Copéret (CCH) was trained in chemistry and chemical engineering in CPE Lyon (France) and then undertook a PhD in chemistry at Purdue University (USA), where he studied the development of highly efficient synthesis of complex molecules via Pd-catalyzed carbonylation reactions in the group of Prof. E.i. Negishi ().
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Experiments were performed in the following five key areas: thick film substrate fabrication, component attachment, substrate mounting, wirebonding, and.
Peter Ramm is author or co-author of over publications and 24 patents. He received the "Ashman Award " from the International Electronics Packaging Society (IMAPS) "For Pioneering Work on 3D IC Stacking and Integration, and leading-edge work on SiGe and Si technologies".
1. Parametric Dependencies in Thick Film Screening. Duane R. Kobs, Donald R. Voight. Proc International Symposium on Hybrid Microelectronics, pp –, Cited by: 3. riginally created in as the Hybrid Compo-nents Organization (HCO) within Tektronix, the group was tasked with supplying high-performance components for Tektronix’ test equipment.
Sup-porting Tektronix’ ongoing need for high-speed IC packages and RF/microwave modules remains a critical part. DerMarderosian, “The Electrochemical Migration of Metals,”proceedings, International Hybrid Microelectronics Symposium: Google Scholar 3.
Richard G. Gehman, “Dendritic Growth Evaluation of Soldered Thick Film,”proceedings, International Hybrid Microelectronics Symposium: Cited by: 1.
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This paper examines the influence of the materials on the electrical properties of conductors for both high speed MCM structures and microstrip applications. Calculated figures for attenuation in microstrip lines are compared with published results.
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Microelectronics Manufacturing. This note focuses on CMOS manufacturing. Topics covered includes: CMOS process technology, work in progress tracking, CMOS.VAL R. MARINOV "Flexible Hybrid Electronics" "chip-in-paper" RFID "smart paper" "ultrathin chip" Books and book chapters. 39th International Symposium on Microelectronics, San Diego, California, OctoberMarinov, V.
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